Laminates and Prepregs

RoHS compliant copper clad laminates, including dicy-free laminates for lead free PCB assembly, polyimide laminates for high performance multilayer PCBs, high frequency and microwave materials and aramid reinforced electronic substrates.

Standard Epoxy Laminates >

Our range of FR4 grade Epoxy/glass laminates and prepregs includes both traditional Dicy cured 135Tg and 140Tg options…

Signal Integrity >

Low dielectric constant, low loss multilayer thermoset laminates and prepregs for high speed digital applications demanding lower loss…

Green (Halogen free) Laminates >

Halogen free epoxy resin copper clad laminates and prepregs.

Low Flow \ No Flow Prepregs >

A range of epoxy and polyimide prepregs with controlled flow properties for heat sink bonding and flex-rigid multilayer…

High Performance (Polyimide) >

Polyimide laminates, prepregs and hole filling materials for high performance, high Tg multilayer printed circuit boards.

RF Microwave >

PTFE based laminates reinforced with glass fibre in a range of options of dielectric constant and dissipation factor…

Thermally Reliable Epoxy Laminates >

Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Such…